Shenzhen Mivo Electronics Co., Ltd. integrates bare board fabrication, active and passive component sourcing, high-speed SMT placement, through-hole soldering, and custom testing into a streamlined, risk-free manufacturing process.
High-precision automated pick-and-place lines supporting 01005 passive chips, 0.35 mm pitch BGA, QFN, WLCSP, and fine-pitch connectors under ISO9001 and IPC-A-610 Class 2/3 criteria.
Leveraging direct access to Shenzhen's premier component distributors. 100% authentic electronic components with complete traceability and verified alternatives for discontinued parts.
Thorough design-for-manufacturing checks on Gerber files, BOM matching, footprint pad geometries, thermal reliefs, and polarity orientations before production begins.
Automated Optical Inspection (AOI), X-Ray inspection for hidden joints, in-circuit test (ICT), custom functional testing (FCT), burn-in aging, and on-board MCU firmware flashing.
Explore representative turnkey assemblies manufactured by Shenzhen Mivo Electronics Co., Ltd. across consumer robotics, industrial automation, power electronics, and automotive subsystems.
OEM / ODM
Full-turnkey circuit board assembly built strictly to client Gerber archives and validated BOM. Features mixed SMT and through-hole placement on multilayer FR-4.
Power Module
Heavy copper layer routing engineered for high current capacity, low thermal impedance, and high acoustic fidelity in industrial and commercial power stages.
Robotics & AI
High-density intelligent main controller board featuring multi-axis motor driver integration, ultrasonic obstacle interface, and Wi-Fi / BLE communication modules.
Embedded MCU
End-to-end hardware manufacturing bundled with on-line IC flashing, serial number burning, and automated bootloader validation before ESD protective packaging.
Quick-Turn
Fast-track prototyping service designed to validate engineering revisions rapidly. Dedicated NPI lines ensure quick setup with precision laser-cut SMT stencils.
Automotive Grade
High-reliability circuit assemblies conforming to stringent vehicular standards, temperature cycling durability (-40°C to +125°C), and conformal coating protection.
Shenzhen Mivo Electronics Co., Ltd. operates state-of-the-art SMT lines and wave soldering equipment in Shenzhen, providing tight tolerance assembly across diverse electronic sectors.
| Capability Parameter | Prototype Specification | Volume Production Specification |
|---|---|---|
| PCB Layer Count | 1 to 32 Layers (Rigid, Flex, Rigid-Flex) | 1 to 24 Layers Standard / HDI Any-Layer |
| Minimum Component Size | 01005 (0402 metric) passive chips | 0201 / 0402 passive chips |
| BGA / IC Pitch Precision | Pitch ≥ 0.35 mm, Ball diameter ≥ 0.15 mm | Pitch ≥ 0.40 mm, BGA / CSP / QFN / WLCSP |
| Maximum Board Dimensions | 510 mm × 460 mm (Single / Panelized) | 600 mm × 500 mm Large Panel Format |
| Minimum Board Thickness | 0.2 mm (2-layer) / 0.4 mm (Multilayer) | 0.4 mm to 3.2 mm standard range |
| Soldering Technologies | Lead-Free Nitrogen Reflow, Selective Solder | Dual-Wave Soldering, Nitrogen Reflow SMT |
| Inspection & QA Level | 100% 3D SPI, 3D AOI, 2D/3D X-Ray, Manual QC | In-line AOI, X-Ray Sampling, Automated FCT |
| Surface Finishing Available | ENIG, Immersion Silver, OSP, HASL Lead-Free | Immersion Gold (ENIG), ENEPIG, Hard Gold |
| Firmware & Programming | Off-line gang programmer or in-circuit JTAG | Automated fixture flashing with checksum verification |
| Quality Standard Compliance | IPC-A-610 Class 2 / Class 3, RoHS, REACH | ISO9001 certified manufacturing workflow |
To eliminate defects and maintain dependable yields for overseas shipments, each production batch passes through our strict multi-gate inspection framework.
Every reel, tube, and bare PCB undergoes microscope visual verification, solderability check, and MPN matching against the approved BOM.
High-resolution solder paste inspection assesses volume, height, area, and bridging before components are placed by SMT mounters.
High-speed dual-sided AOI validates component presence, polarity, alignment, tombstoning, and solder meniscus quality after reflow.
High-penetration X-Ray verifies hidden joints underneath BGAs, CSPs, and leadless power packages to detect bridging, voids, or cold solder.
Complete power-up, voltage rail verification, MCU programming, peripheral tests, and vacuum anti-static ESD packaging for worldwide delivery.
Upload your Gerber files (RS-274X) and complete Bill of Materials (BOM). Our engineering team at Shenzhen Mivo Electronics Co., Ltd. will analyze your design, run a complimentary DFM check, and provide an itemized quote within 24 hours.