Waterproof PE Temperature & Humidity Sensor Shell
SHT10, SHT11, SHT20, SHT30 compatible housing. Sintered PE porous filter head with high anti-condensation sealing.
Featured Electro-Optical & Precision Sensor Products
Explore our core portfolio of wafer-level photodiodes, sensor housings, and electro-mechanical modules engineered to rigorous European tolerances.
Metal Shell TO46 SG-PIN46MR-V High-Speed Photodiode
Fast response, 450nm optimized visible/NIR band silicon photocell housed in a hermetically sealed low-noise TO-46 can.
PZT Semicircular Piezoelectric Ceramic Sensor
Profiled hyperchromatic waveguide transducer for non-destructive ultrasonic acoustic emission & structural resonance testing.
130×100×10mm Aluminum Radiator Heat Sink
Precision extruded aluminum cooler with industrial thermal adhesive tape for high-density optoelectronics, SSD, CPU & PCBA dissipation.
PT100 RTD Temperature Sensor Probe 5×50mm
Class A platinum resistor, 3-wire system, 1-5m high-purity silicone gel coat. Waterproof, oil-proof cryogenic & thermal resilience.
Pointed Pierce-Type Platinum RTD Probe
Needle-point penetration tip (PT100A/PT1000). Rapid thermal equilibration for bioprocessing, cold-chain, and lab immersion test beds.
Stainless Steel Wire Lug Temperature Sensor Housing
Surface-mount 4mm screw eyelet lug fabricated from stamped 201 stainless steel. Superior heat coupling for battery packs & motor enclosures.
16mm Waterproof Ultrasonic Transceiver Probe
Integrated transceiver module for automotive park assist, robotics rangefinding, and IoT liquid level telemetry in harsh ambient environments.
8+
Years Exporting Globally via Alibaba.com
4.7/5
Verified Buyer Trust Rating
<0.05%
Wafer Die Dark Current Deviation
5pcs
Ultra-Flexible PCBA & Prototype MOQ
Engineering Overview: Bare Silicon Photodiode Wafers for High-Reliability Systems
Bare silicon photodiode wafers represent the foundational building block for modern optoelectronic transceivers, radiation detectors, analytical spectrometers, and industrial laser diagnostics. Unlike standard pre-packaged components (e.g., molded plastic epoxy or surface-mount leaded packages), procuring at the bare wafer or diced unmounted die level affords photonic systems engineers complete control over optical coupling geometry, parasitic capacitance, thermal dissipation paths, and sub-nanosecond rise-time tuning.
Shenzhen Mivo Electronics exports raw, unmounted monocrystalline planar diffusion and PIN silicon photodiode wafers engineered from ultra-pure, high-resistivity float-zone (FZ) or Czochralski (CZ) ingots. Featuring planar passivated junctions, thermally grown silicon dioxide (SiO2) or specialized silicon nitride (Si3N4) anti-reflective coatings (ARC), our wafers maximize spectral responsivity across the ultraviolet (UV), visible (VIS), and near-infrared (NIR) wavelengths (190 nm to 1100 nm). Each wafer is subjected to micron-level wafer thickness mapping, laser-scribed dicing grid preparation, and cleanroom automated probing to ensure sub-nanoampere dark currents and high shunt resistance across all functional dice.
Planar Passivated PIN Architecture
Fabricated with an intrinsic high-resistivity layer between p+ and n+ regions, resulting in an ultra-wide depletion region at low reverse bias. Delivers cutoff frequencies in excess of 1 GHz with sub-nanosecond rise/fall transients.
Optimized ARC & Quantum Efficiency
Customizable dielectric anti-reflective coatings tuned specifically for 405nm (blue laser), 650nm (visible red), or 850/905nm (NIR LiDAR/rangefinding), achieving quantum efficiencies surpassing 85% with minimal surface recombination.
Packaging & Sub-Mount Flexibility
Supplied on UV dicing tape, Grip-Ring carriers, or conductive Gel-Pak trays. Dice are fully metallized on front (anode wire-bondable Au or Al) and backside (cathode solderable Au/Sn or conductive epoxy compatible) for hybrid micro-assembly.
Comparative Technical Parameters: Wafer Selection Matrix
For research teams and microelectronic assembly lines throughout the Greater Stockholm region, selecting the correct wafer thickness, active area geometry, and doping profile directly dictates the optical noise floor (NEP) and dynamic range of the terminal device. The table below outlines our standard exporter catalog grades:
| Wafer / Die Series | Active Area Geometry | Spectral Peak | Dark Current (Id @ Vr) | Junction Capacitance | Primary Industrial Use |
|---|---|---|---|---|---|
| MIVO-SPD-UVB UV Enhanced | 1.0 × 1.0 mm to 10 × 10 mm | 360 nm (200–400 nm) | < 50 pA @ 0V | 120 pF / cm² | Biotech fluorescence, ozone sensing, water sterilization monitors |
| MIVO-SPD-VIS High Shunt | Round / Square (Custom Die) | 550 nm (Photopic match) | < 20 pA @ 10mV | 350 pF / cm² | Nordic precision optical lux meters, colorimetry, camera sensors |
| MIVO-PIN-FAST High Speed | 0.5 × 0.5 mm or 1.2 mm² | 850 / 905 nm | < 0.5 nA @ 10V | 1.8 pF @ 10V | Autonomous driving LiDAR, time-of-flight (ToF), fiber optic hubs |
| MIVO-QUAD-POS Quadrant Array | Segmented 4-Quadrant (Gap 40μm) | 650 nm / 850 nm | < 100 pA / quadrant | 15 pF / segment | Laser beam alignment, multi-axis target tracking, robotics deflection |
Localized Stockholm Market Dynamics & Emerging Applications
Stockholm is recognized across the European Union as a powerhouse for photonics innovation, automated green shipping, precision robotics, and MedTech design. Often centered around northern hubs like Kista Science City (Sweden's premier ICT and electronics cluster) and research epicenters like KTH Royal Institute of Technology and Karolinska Institutet, local hardware innovators require agile, high-precision semiconductor supply lines.
As Swedish original equipment manufacturers (OEMs) shift toward localized green-tech initiatives, life sciences, and Industry 4.0 automation, off-the-shelf catalog photodiodes frequently prove too bulky, thermally inefficient, or acoustically restricted. Shenzhen Mivo Electronics bridges this gap by acting as a direct engineering-to-production exporter, supplying bare photodiode wafers, custom hybrid ceramic sub-mounts, and matched PCBA sensor assemblies with uncompromised traceability.
Medical & Life Sciences
Hagastaden MedTech
Stockholm's life-science cluster utilizes custom bare photodiode dice for point-of-care microfluidic chips, in-vitro blood gas analyzers, and spectrophotometers demanding near-zero dark current noise floor.
Industrial IoT & Telemetry
Kista Optics & Telecom
Integrated photodetection dice powering next-generation optical transceivers, dense optical cross-connects, and free-space optics (FSO) links across Nordic cold-climate wireless infrastructure.
CleanTech & Green Energy
Nordic Climate Sensing
Coupling bare photocells and SHT30/PT100 sensors into remote meteorological stations, heat pump optimization arrays, and forestry canopy solar-penetration logging equipment.
Industrial Automation
Robotics & Heavy Tech
High-speed pulse detection for laser curtain safety, precision alignment in Swedish automated mining loaders, and autonomous harbor logistics around the Baltic Sea coastline.
Why Stockholm Engineers & Buyers Partner with Shenzhen Mivo Electronics
Navigating cross-border component procurement between Sweden and China requires absolute reliability, rigorous technical vetting, and rapid turnarounds. Shenzhen Mivo Electronics Co., Ltd. is not merely a broker; we are an onsite-verified manufacturer established in Shenzhen's world-class microelectronics hub, operating complete production, inspection, and component mounting facilities.
Verified Supplier Credentials
Our facilities have successfully passed independent third-party and Alibaba.com onsite audits. With over 8 consecutive years of transparent global trade history and a 4.7/5 verified buyer score, we assure Swedish buyers full accountability.
From Wafer Die to Turnkey PCBA
Eliminate multiple middleman vendors. We supply bare photodiode wafers, solder paste stencils, multilayer and aluminum-core PCBs, SMT component mounting, and custom probe wire harnesses directly from a unified project team.
Prototyping Starting from 5 Pcs
We empower Swedish hardware startups and corporate R&D groups with custom prototypes starting from just 5 pieces for PCBA and low MOQ on bare photodiode dice, enabling agile bench testing before scaling into container-volume production.
Frequently Asked Questions: Stockholm Wafer & Electronics Procurement
Direct answers addressing the technical, regulatory, logistical, and commercial inquiries common among Swedish procurement directors and hardware engineering teams.
How are bare silicon photodiode wafers packaged to withstand international air freight to Stockholm Arlanda (ARN)?
Our bare wafers and sliced dies are packaged in Class 100/1000 cleanroom environments. Whole wafers are mounted on high-tack UV dicing tape inside antistatic coin-box carriers, or vacuum sealed in double-layer ESD-shielded nitrogen-purged moisture barrier bags (MBBs). Individual diced chips are delivered in Gel-Pak conductive carriers or waffle packs to guarantee zero surface micro-scratching or particulate contamination during transit to Stockholm or anywhere in Sweden.
Do your photodiode wafers, sensors, and PCBA products comply with EU RoHS and REACH regulations?
Yes. All materials exported to Sweden and the European Union are 100% compliant with RoHS Directive 2011/65/EU (and its amendments) as well as the EU REACH (EC 1907/2006) candidate list of Substances of Very High Concern (SVHC). We provide full chemical composition declarations, RoHS test reports from certified testing bodies, and Certificates of Conformity (CoC) alongside your shipping manifests.
Can Mivo Electronics provide custom die geometries or multi-element linear photodiode arrays?
Absolutely. In addition to standard single-element square dice (such as our 10×10 mm or 5×5 mm linear cells), we custom fabricate dual-element (split-cell), quadrant (4-quadrant), and 16-to-64 element linear multi-channel photodiode arrays. Buyers can specify the guard ring structure, isolation trench widths, contact pad metallization (Au for wire bonding, solderable Sn/Ag/Cu alloys), and anti-reflective spectral coatings directly via CAD / GDSII drawings.
What is the standard lead time for delivery to Swedish research laboratories or production plants?
For catalog items and stocked bare wafer dice (such as our high-speed PIN photodiodes and PT100 RTD sensor assemblies), dispatch occurs within 3 to 5 business days, with expedited express shipping (DHL/FedEx/UPS) reaching Stockholm Arlanda in approximately 3 to 5 transit days. Custom diffused wafer runs or bespoke turnkey PCBA projects typically require 2 to 3 weeks for engineering pilot validation, followed by immediate air shipment.
Can you assemble our photodiodes onto custom ceramic or aluminum flex PCB boards in-house?
Yes. This is one of Mivo Electronics' primary competitive advantages over raw semiconductor foundries. Our Shenzhen manufacturing lines include precision die-attach, thermosonic gold wire bonding (COB), SMT fine-pitch pick-and-place lines, and optical alignment fixtures. We can mount your bare photodiode dice directly onto custom high-thermal-conductivity aluminum core PCBs, high-frequency ceramic substrates, or flex circuits (FPC), delivering finished, tested sub-assemblies.
Request Technical Data Sheets & Wafer Quotations for Stockholm
Whether you require unmounted silicon photodiode wafers, diced array wafers, or complete turnkey PCBA sensor integrations, our technical sales engineers are ready to review your mechanical drawings and Gerber packages.