1 / 4
130*100*10mm Aluminum Heatsink Radiator Heat Sink for Electronic RAM Chip PCB LED CPU SSD Cooling With Thermal Conductive Tape
Product Description
Thermal Management Solutions
130*100*10mm Aluminum Heatsink Radiator Heat Sink for Electronic RAM Chip, PCB, LED, CPU, SSD Cooling with Thermal Conductive Tape
Custom Size and Shape for all kinds of Aluminum Heatsink, WaterBlock, CopperTube, and Thermoelectric Cooler.
Offer double-sided thermal sticker service for fast and effortless installation.
Support bulk orders and custom service orders. Please send your required dimensions and technical drawings for inquiries.
Available Standard & Custom Lengths
- 100mm
- 150mm
- 200mm
- 250mm
- 300mm
- 400mm
- Custom Lengths Available
Product Gallery
Frequently Asked Questions
What applications is this aluminum heatsink suitable for?
This heatsink is specifically designed for passive or active thermal dissipation across electronic components including RAM chips, printed circuit boards (PCBs), high-power LEDs, CPUs, solid-state drives (SSDs), and power semiconductor modules.
Is double-sided thermal tape included with the heatsink?
Yes, we provide pre-applied high-performance double-sided thermal conductive tape to enable quick, tool-free installation and optimal heat transfer between the heat source and aluminum radiator fins.
Can I request custom profiles, lengths, or drilling?
Yes, full custom fabrication services are available. We can manufacture customized sizes, profile shapes, mounting holes, and fin structures based on your technical CAD drawings or project requirements.
What lengths can be ordered for this heatsink profile?
Standard lengths include 100mm, 150mm, 200mm, 250mm, 300mm, and 400mm. Additional continuous cut-to-length options can be tailored to meet your design specifications.
Do you handle wholesale and bulk OEM production?
Yes, we accept both small customized batches and high-volume commercial orders. Simply submit your dimensional requirements or drawings to receive a quotation and production schedule.
